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INTEGRATED CIRCUITS
DATA SHEET
TDA1545A Stereo continuous calibration DAC
Preliminary specification Supersedes data of March 1993 File under Integrated Circuits, IC01 1997 Sep 04
Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
FEATURES * Space saving packages * Low power consumption * Low total harmonic distortion * Wide dynamic range (16-bit resolution) * Continuous calibration concept * Easy application: single 3 to 5.5 V rail power supply and output- and bias current are proportional to the supply voltage * Fast settling time permits 2x, 4x and 8x oversampling (serial input) or double speed operation at 4x oversampling * Internal bias current ensures maximum dynamic range * Wide operating temperature range of -40 to +85 C * Compatible with most of the Japanese input formats: time multiplexed, two's complement and TTL * No zero crossing distortion. ORDERING INFORMATION TYPE NUMBER TDA1545A TDA1545AT TDA1545ATT PACKAGE NAME DIP8 SO8 TSSOP14 DESCRIPTION plastic dual in-line package; 8 leads (300 mil) plastic small outline package; 8 leads; body width 3.9 mm GENERAL DESCRIPTION
TDA1545A
The TDA1545A is the first device of a new generation of the digital-to-analog converters which embodies the innovative technique of continuous calibration. The largest bit-currents are repeatedly generated by one single current reference source. This duplication is based upon an internal charge storage principle having an accuracy insensitive to ageing, temperature and process variations. The device is fabricated in a 1.0 m CMOS process and features an extremely low power dissipation, small package size and easy application. Furthermore, the accuracy of the high coarse current combined with the implemented symmetrical offset decoding method preclude zero-crossing distortion and ensures high quality audio reproduction. Therefore, the continuous calibration digital-to-analog converter is eminently suitable for use in (portable) digital audio equipment.
VERSION SOT97-1 SOT96-1 SOT402-1
plastic thin shrink small outline package; 14 leads; body width 4.4 mm
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
QUICK REFERENCE DATA SYMBOL VDD IDD IFS THD PARAMETER supply voltage supply current full-scale output current total harmonic distortion VDD = 5 V; at code 0000H VDD = 5 V VDD = 3 V including noise at 0 dB at 0 dB at -60 dB at -60 dB at -60 dB; A-weighting at -60 dB; A-weighting at -60 dB; A-weighting; R3 = R4 = 11 k; IFS = 2 mA S/N signal-to-noise ratio at bipolar zero A-weighting; at code 0000H R3 = R4 = 11 k; IFS = 2 mA tcs BR fBCK TCFS Ptot current settling time to 1 LSB input bit rate at data input clock frequency at clock input full-scale temperature coefficient at analog outputs (IOL; IOR) total power dissipation at code 0000H VDD = 5 V VDD = 3 V Tamb operating ambient temperature - - -40 15 6 - 86 - - - - - 98 101 0.2 - - 400 - 1.4 - 1.7 - - - - - -88 0.004 -33 2.2 -35 CONDITIONS 3 - 0.9 - MIN. 5 3.0 1.0 0.6 TYP.
TDA1545A
MAX. 5.5 4.0 1.1 - -78 0.01 -24 6 - - - V
UNIT mA mA mA dB % dB % dB % %
- - - 18.4 18.4 -
dB dB s Mbits/s MHz ppm
20 - +85
mW mW C
1997 Sep 04
3
k, full pagewidth
1997 Sep 04
1 nF C1 3.9 k I BL IOL R1 Vout left VREF RIGHT OUTPUT LATCH 1 nF C2 I BR IOR R2 Vout right VREF 11-BIT PASSIVE DIVIDER OP2 RIGHT BIT SWITCHES (14) 8 3.9 k OP1 (10) 6
Philips Semiconductors
LEFT OUTPUT LATCH
LEFT BIT SWITCHES
Stereo continuous calibration DAC
11-BIT PASSIVE DIVIDER
I REF I BL IREF I BR
32 (5-BIT) CALIBRATED CURRENT SOURCES AND 1 CALIBRATED SPARE SOURCE IREF
32 (5-BIT) CALIBRATED CURRENT SOURCES AND 1 CALIBRATED SPARE SOURCE
4
LEFT INPUT LATCH REFERENCE SOURCE R REF 11 k RIGHT INPUT LATCH I
(13) 7 REF
R4 33 k (E24)
V REF
BCK
1 (1)
(E24)
R3 22 k
C4 1 F
WS
2 (2)
DATA
3 (6)
CONTROL AND TIMING
TDA1545A
(9) 5 C3 100 nF (7) 4 ground
VDD
MCD287 - 1
The numbers given in parenthesis refer to the TDA1545ATT (SOT402-1) version.
Preliminary specification
TDA1545A
Fig.1 Block diagram.
Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
PINNING PIN SYMBOL BCK WS DATA GND VDD IOL IREF IOR n.c. SOT96-1; SOT97-1 1 2 3 4 5 6 7 8 - DESCRIPTION SOT402-1 1 2 6 7 9 10 13 14 3, 4, 5, 8, 11, 12 bit clock input word select input data input ground positive supply voltage left channel output reference current input right channel output not connected
TDA1545A
handbook, halfpage
BCK 1
handbook, halfpage
14 IOR 13 IREF 12 n.c.
BCK 1 WS 2 TDA1545A DATA 3 GND 4
MCD288 - 1
8 7 6 5
IOR I REF IOL VDD
WS 2 n.c. 3
n.c. 4 TDA1545ATT 11 n.c. n.c. 5 DATA 6 GND 7
MBK230
10 IOL 9 VDD 8 n.c.
Fig.2 Pin configuration (SOT96-1; SOT97-1).
Fig.3 Pin configuration (SOT402-1).
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
FUNCTIONAL DESCRIPTION The basic operation of the continuous calibration DAC is illustrated in Fig.4. The figure shows the calibration principle (Fig.4a) and operation principle (Fig.4b). During calibration of the MOS current source (Fig.4a) transistor M1 is connected as a diode by applying a reference current. The voltage Vgs on the intrinsic gate-source capacitance Cgs of M1 is then determined by the transistor characteristics. After calibration of the drain current to the reference value IREF, the switch S1 is opened and S2 is switched to the other position (Fig.4b). The gate-to-source voltage Vgs of M1 is not changed because the charge on Cgs is preserved. Therefore the drain current of M1 will still be equal to IREF and this exact duplicate of IREF is now available at the Iout terminal. The 32 current sources and the spare current source of the TDA1545A are continuously calibrated (see Fig.1). The spare current is included to allow for continuous convertor operation. The output of one calibrated source is connected to an 11-bit binary current divider consisting of 2048 transistors. A symmetrical offset decoding principle is incorporated and arranges the bit switching in such a way that the zero-crossing is performed only by the LSB currents. Notes to the functional description 1. IFS = AFS x IREF and Ibias = Abias x IREF 2. V DD1 I FS1 I bias1 ------------- = ---------- = ------------V DD2 I FS2 I bias2 V DD I REF = I REF - -------------------------------------------------------------------------------------------------------R3 + R3 + R4 + R4 + R REF + R REF
TDA1545A
The TDA1545A accepts input serial data formats of 16-bit word length. Left and right data words are time multiplexed. The most significant bit (bit 1) must always be first. The format of data input is shown in Figs 5 and 6. With a LOW level on the word select input (WS) input data is placed in the right input register and with a HIGH level on the WS input data is placed in the left input register. The data in the input registers is simultaneously latched in the output registers which control the bit switches. An internal bias current Ibias (see IBL and IBR in Fig.1) is added to the full-scale output current IFS in order to achieve the maximum dynamic range at the outputs of OP1 and OP2 (see Fig.1). The reference input current IREF controls with gain AFS the current IFS which is a sink current and with gain Abias the Ibias which is a source current (note 1). The current IREF is proportional to VDD so the IFS and Ibias will also be proportional to VDD (note 2) because AFS and Abias are constant. The reference output voltage VREF in Fig.1 is 23VDD. In this way the maximum dynamic range is achieved over the entire power supply range. The tolerance of the reference input current in Fig.1 depends on the tolerance of the resistors R3, R4 and RREF (note 3).
3.
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
TDA1545A
handbook, full pagewidth
out I REF
out I REF I REF
S2
S2
S1 M1 Vgs
S1 M1 Vgs
C gs
Cgs
MCD289 - 1
(a)
(b)
Fig.4 Calibration principle; (a) calibration, (b) operation.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VP Txtal(max) Tstg Tamb Ves PARAMETER positive supply voltage maximum crystal temperature storage temperature operating ambient temperature electrostatic handling note 1 note 2 Notes 1. Equivalent to discharging a 100 pF capacitor via a 1.5 k series resistor. 2. Machine model; C = 200 pF, L = 0.5 H, R = 10 , 3 zaps positive and negative. THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT97-1 SOT96-1 SOT402-1 PARAMETER thermal resistance from junction to ambient in free air 100 160 155 K/W K/W K/W VALUE UNIT CONDITIONS - - -55 -40 -2000 -200 MIN. 6 +150 +150 +85 +2000 +200 MAX. V C C C V V UNIT
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
CHARACTERISTICS VDD = 5 V; Tamb = 25 C; measured in the circuit of Fig.1; unless otherwise specified. SYMBOL VDD IDD RR PARAMETER supply voltage supply current ripple rejection note 1 note 2 CONDITIONS - - - - - - - - - 54 15 15 12 2 2 12 MIN. 3.0 TYP. 5.0 3.0 30 - - - - - - - - - - - - - -
TDA1545A
MAX. 5.5 4.0 - V
UNIT mA dB A A MHz Mbits/s kHz
Digital inputs (WS; BCK; DATA) |IIL| |IIH| fBCK BR fWS tr tf tCY tHB tLB tSU;DAT tHD;DAT tHD;WS tSU;WS input leakage current LOW input leakage current HIGH bit clock input frequency bit rate data input word select input VI = 0.8 V VI = 2.4 V 10 10 18.4 18.4 384
Timing (see Fig.5) rise time fall time bit clock cycle time bit clock HIGH time bit clock LOW time data set-up time data hold time word select hold time word select set-up time 12 12 - - - - - - - ns ns ns ns ns ns ns ns ns
Analog input (IREF) RREF RES VDCC IFS TCFS Ibias AFS Abias reference resistor see Fig.1 7.4 - 2.0 0.9 - 643 - - 11.0 - - 1.0 400 714 13.2 9.42 14.6 k
Analog outputs (IOL and IOR) resolution DC output voltage compliance full-scale current full-scale temperature coefficient bias current reference input current to full-scale output current gain reference input current to bias current gain 16 1.1 - 785 - - bit mA ppm A VDD - 1 V
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
TDA1545A
SYMBOL THD
PARAMETER total harmonic distortion
CONDITIONS including noise at 0 dB; note 3; see Fig.7 including noise at -60 dB; note 3; Fig.7 including noise at -60 dB, A-weighting R3 = R4 = 11 k see Fig.1; IFS = 2 mA including noise at 0 dB; note 4 - - - - - - - - - -
MIN.
TYP. -88 0.004 -33 2.2 -35 1.8 1.4 -84 0.006 0.2 95 0.2 0.2 98 101
MAX. -78 0.01 -24 6 - - - -70 0.03 - - 0.3 - - -
UNIT dB % dB % dB % % dB % s dB dB s dB dB
tcs |dIO| |td| S/N
settling time 1 LSB channel separation unbalance between outputs delay time between outputs signal-to-noise ratio (A-weighting) at bipolar zero note 1 note 5 note 3
86 - - 86 -
Notes 1. At code 0000H. 2. Vripple = 1% of supply voltage and fripple = 100 Hz. 3. Measured with 1 kHz sinewave generated at a sampling rate of 192 kHz. 4. Measured with 1 kHz sinewave over a 20 Hz to 20 kHz bandwidth generated at a sampling rate of 192 kHz. 5. R3 = R4 = 11 k; see Fig.1; IFS = 2 mA.
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
TEST AND APPLICATION INFORMATION
TDA1545A
LEFT
handbook, full pagewidth
WS tr 12 t HB 15 BCK
RIGHT t f 12 t LB 15 t HD;WS 2
t SU;WS 12
t CY
54 t SU;DAT 12
t HD;DAT 2
DATA
LSB
MSB
MLB001
SAMPLE OUT
Fig.5 Timing and input signals.
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
TDA1545A
LSB
MSB
RIGHT
MLB002
handbook, full pagewidth
MSB
LEFT
DATA
BCK
1997 Sep 04
11
WS
SAMPLE OUT
Fig.6 Format of input signals.
LSB
Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
APPLICATION INFORMATION
TDA1545A
MGA054
full pagewidth
20 THD (dB) 30 (1)
10 THD (%) 1
40
50
60
0.1
70
80 (2) 90 10
0.01
10 2
10
3
frequency (Hz)
10 4
(1) Measured including all distortion plus noise at a level of -60 dB. (2) Measured including all distortion plus noise at a level of -0 dB. The sample frequency 4FS: 176.4 kHz. The graphs are constructed from average values of a small amount of engineering samples therefore no guarantee for typical values is implied.
Fig.7 Total harmonic distortion as a function of frequency (4FS).
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
TDA1545A
MGA055
MGA056
handbook, halfpage
100
handbook, halfpage
50
THD (dB) 80
THD (dB) 60
60
70 (2) 80 (1)
40
20
90
0 100
100 80 60 40 20 signal level (dB) 0 1 2 3 4 5 VDD (V) 6
The sample frequency 4FS: 176.4 kHz. The graphs are constructed from average values of a small amount of engineering samples therefore no guarantee for typical values is implied.
(1) Measured within the specified operating supply voltage range. (2) Measured outside the specified operating supply voltage range. The sample frequency 4FS: 176.4 kHz. The graphs are constructed from average values of a small amount of engineering samples therefore no guarantee for typical values is implied.
Fig.8
Total harmonic distortion as a function of signal level (4FS).
Fig.9
Total harmonic distortion as a function of supply voltage VDD (4FS).
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
PACKAGE OUTLINES DIP8: plastic dual in-line package; 8 leads (300 mil)
TDA1545A
SOT97-1
D seating plane
ME
A2
A
L
A1
c Z e b1 wM (e 1) b2 5 MH
b 8
pin 1 index E
1
4
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.14 0.068 0.045 b1 0.53 0.38 0.021 0.015 b2 1.07 0.89 0.042 0.035 c 0.36 0.23 0.014 0.009 D (1) 9.8 9.2 0.39 0.36 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 1.15 0.045
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT97-1 REFERENCES IEC 050G01 JEDEC MO-001AN EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-04
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
TDA1545A
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A X
c y HE vMA
Z 8 5
Q A2 A1 pin 1 index Lp 1 e bp 4 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.014 0.0075
0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024
0.028 0.004 0.012
8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03S JEDEC MS-012AA EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-02-04 97-05-22
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
TDA1545A
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
D
E
A
X
c y HE vMA
Z
14
8
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
7
wM detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.10 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1.0 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.72 0.38 8 0o
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT402-1 REFERENCES IEC JEDEC MO-153 EIAJ EUROPEAN PROJECTION ISSUE DATE 94-07-12 95-04-04
1997 Sep 04
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO and TSSOP REFLOW SOLDERING Reflow soldering techniques are suitable for all SO and TSSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. 1997 Sep 04 17
TDA1545A
Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering can be used for all SO packages. Wave soldering is not recommended for TSSOP packages, because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering is used - and cannot be avoided for TSSOP packages - the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, do not consider wave soldering TSSOP packages with 48 leads or more, that is TSSOP48 (SOT362-1) and TSSOP56 (SOT364-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA1545A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
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Philips Semiconductors
Preliminary specification
Stereo continuous calibration DAC
NOTES
TDA1545A
1997 Sep 04
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1997
Internet: http://www.semiconductors.philips.com
SCA55
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
547027/1200/03/pp20
Date of release: 1997 Sep 04
Document order number:
9397 750 02703

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